Packaging & Test Services
Complete back-end capabilities from wafer to packaged, tested products
UMS Back-End Capabilities
À la carte services on wafer or products - from individual process steps to complete MMIC manufacturing
UMS operates complete in-house back-end capabilities at their European manufacturing facility. Foundry customers can select individual process steps or a complete turn-key service from wafer to packaged, tested products. All back-end processes are performed under strict quality control with full traceability, meeting space and defense qualification requirements.
Back-End Process Steps
Six core capabilities covering the full back-end flow
Wafer Probing
On-wafer RF testing using multi-port RF probe stations. S-parameter, noise figure, and power measurement at wafer level before dicing. Identifies known-good-die (KGD) before packaging.
Wafer Thinning & Backside Processing
Wafer thinning to 100 μm or 50 μm for improved thermal and high-frequency performance. Backside metallization for low-inductance ground connection through vias.
Die Sorting & Attach
Automated die sorting based on wafer probe test data. Pick-and-place die attach using conductive epoxy or eutectic soldering (AuSn) for optimal thermal and electrical performance.
Wire Bonding & Ribbon Bonding
Au wire bonding (25 μm) and ribbon bonding for low-inductance interconnects. Multiple bond layer options for complex MMICs with many I/Os.
Packaging
Complete packaging in ceramic, metal, or plastic packages. Leadless (QFN), leaded, and BGA package options. Custom package design available for specialized RF interfaces.
Final Test & Qualification
Complete RF testing of packaged parts. Environmental qualification including temperature cycling, HTOL, and pre-conditioning per JEDEC and MIL standards. Space screening per ESCC/MIL-PRF-38534 available.
Package Options
Standard and custom package solutions for MMICs
Ceramic Packages
Multi-layer ceramic packages with excellent RF performance up to 110 GHz. Available in standard leadless and leaded configurations. Hermetic sealing option for space and defense.
Metal Packages
Kovar or aluminum metal packages with ceramic feedthroughs. Excellent shielding and thermal dissipation. Suitable for high-power GaN MMICs.
Plastic QFN/BGA
Low-cost plastic packages for commercial and industrial applications. QFN up to 40 GHz, BGA for high-I/O count MMICs. Moisture sensitivity level (MSL) classification available.
Need packaging and test services?
Contact TMT to discuss your back-end requirements. UMS offers flexible, à la carte back-end services - from wafer probing only to complete turn-key packaged and tested products.
Foundry Inquiry