Back-end Services
Apart from traditional foundry services (Design Kits delivery, manufacturing), UMS has developed a large range of optimised services to minimise lead time and shorten design cycle.
On-Wafer Tests
Testing is performed in the controlled environment of a class 10000, 700 m² clean room. You will benefit from a unique set of automated on-wafer testing solutions for circuit characterization and sorting according to your product specifications.
17 automatic test stations enable full circuit characterization from 1 to 110 GHz. 100% functional on-wafer tests are available (S-parameters, DC, noise, CW or pulsed power).
Dicing, Picking & Visual Inspection
Dicing
UMS benefits from laser dicing equipment for GaAs, providing precise and clean die separation.
Visual Inspection
Your circuits can benefit from visual inspections according to your required commercial or space screening level.
Picking
According to your sorting criteria, individual die numbering allows identification of your chips. Known Good Die may be delivered in Gel-Pack®, waffle pack or on UV-film.
Prototyping
UMS has qualified an in-house prototyping assembly line for small quantity of chips assembly in package or on board for demo or test jigs. This line includes:
- Ball & Wedge wirebonders
- Ovens for reflow
- 2D and 3D X-ray control
- Fine and gross leak testers
- 100 m² ISO7 clean rooms
QFN Packaging
UMS is enlarging its foundry offer with standard molded plastic packaging. This new offer enables single chip low cost plastic encapsulation of your circuits developed on UMS processes with the BCB option. QFN test is also available on request.
QFN packages from 3×3 mm² to 7×7 mm² are offered. ADS models are available in the associated Design Kit for packaged MMIC designs.
This offer is available for production or prototyping runs with a minimum quantity.
Need Back-End Services?
Contact TMT to discuss your back-end requirements. We coordinate with UMS to provide the right post-fabrication services for your project.
Inquire About Back-End Services